Nitto 31950E
「Nitto 31950E」熱門搜尋資訊
「Nitto 31950E」文章包含有：「HeatReleaseTape」、「HeatReleaseTapes」、「MultiscalewarpagebehaviourinaFan」、「SemiconductorWaferBonding11:Science」、「TWI446420B」、「用於半導體製程之載體分離方法」、「電子零件加工處理專用熱解膠片材REVALPHA」
查看更多
Heat Release Tape
https://www.semicorp.com
Revalpha thermal release materials are a unique and benefits-packed approach to your holding, transfer, carrier masking and protection applications.
Heat Release Tapes
https://cloud2.shopsite.com
Nitto P/N, SEC P/N SKU, Description. Release Temp (DC). Adhesion (n/20MM) ... Revalpha 31950E (4M). $32.00. _DSC0066-FannedLightGreen-Edit.jpg.
Multiscale warpage behaviour in a Fan
https://www.sciencedirect.com
The panel for investigation was produced starting with the lamination of the temporary carrier with a thermal release tape (Nitto 31950E).
Semiconductor Wafer Bonding 11: Science
https://books.google.com.tw
Therefore, we started using thermal release tape Revalpha No.31950E from Nitto Denko. The release temperature of this tape is 200 °C, which is less than the ...
TWI446420B
https://patents.google.com
... 二載體36為一支撐體，該雙面膠帶35可具有於高溫環境下黏度降低的特性，例如是日東電工株式会社(NITTO DENKO)的熱剝離膜(31950E)，該第二載體36可為一半導體晶圓。
用於半導體製程之載體分離方法
https://patentimages.storage.g
境下黏度降低的特性,例如是日東電工株式会社(NITTO. DENKO)的熱剝離膜(31950E),該第二載體36可為一半導. 體晶圓. 參考圖18,移除該第一載體31。在本實施例中,移除該.
電子零件加工處理專用熱解膠片材REVALPHA
https://www.nitto.com
熱解膠帶「REVALPHA」為一獨特膠帶，室溫之下可緊緊黏著，加熱後可輕易剝下。本膠帶有助於各種電子零件製造過程的自動化/ 節省勞力。